Integrated circuit package system with interconnect lock

Details Integrated circuit package system with interconnect lock Integrated circuit package system with interconnect lock

2011-07-26

2011-07-26

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S055000, C438S109000, C438S112000, C438S125000, C438S127000, C257S433000, C257S787000, C257S790000, C257SE33057, C257SE33059

Reexamination Certificate

active

07985628

ABSTRACT:
An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device structure with interconnect lock exposing the device structure; and forming a package encapsulation adjacent to the interconnect lock and over the package carrier.

REFERENCES:
patent: 5333505 (1994-08-01), Takahashi et al.
patent: 5373189 (1994-12-01), Massit et al.
patent: 5950070 (1999-09-01), Razon et al.
patent: 6043109 (2000-03-01), Yang et al.
patent: 6239496 (2001-05-01), Asada
patent: 6252308 (2001-06-01), Akram et al.
patent: 6268654 (2001-07-01), Glenn et al.
patent: 6291884 (2001-09-01), Glenn et al.
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6401545 (2002-06-01), Monk et al.
patent: 6492726 (2002-12-01), Quek et al.
patent: 6653723 (2003-11-01), Manansala
patent: 6727579 (2004-04-01), Eldridge et al.
patent: 6730543 (2004-05-01), Akram
patent: 6861288 (2005-03-01), Shim et al.
patent: 6962282 (2005-11-01), Manansala
patent: 6995448 (2006-02-01), Lee et al.
patent: 7026709 (2006-04-01), Tsai et al.
patent: 7026710 (2006-04-01), Coyle et al.
patent: 7031500 (2006-04-01), Shinohara
patent: 7138706 (2006-11-01), Arai et al.
patent: 7187067 (2007-03-01), Weng et al.
patent: 7227253 (2007-06-01), Tsai et al.
patent: 7245008 (2007-07-01), Lee
patent: 7276393 (2007-10-01), Derderian et al.
patent: 7288835 (2007-10-01), Yim et al.
patent: 7298033 (2007-11-01), Yoo
patent: 7309913 (2007-12-01), Shim et al.
patent: 7391105 (2008-06-01), Yeom
patent: 7468556 (2008-12-01), Logan et al.
patent: 7504284 (2009-03-01), Ye et al.
patent: 7521790 (2009-04-01), Tanida et al.
patent: 7535086 (2009-05-01), Merilo et al.
patent: 7557443 (2009-07-01), Ye et al.
patent: 7589408 (2009-09-01), Weng et al.
patent: 2002/0030261 (2002-03-01), Rolda, Jr. et al.
patent: 2004/0106229 (2004-06-01), Jiang et al.
patent: 2005/0253241 (2005-11-01), Hall
patent: 2006/0014328 (2006-01-01), Shimonaka et al.
patent: 2006/0076690 (2006-04-01), Khandros et al.
patent: 2006/0220256 (2006-10-01), Shim et al.
patent: 2006/0244157 (2006-11-01), Carson
patent: 2006/0256525 (2006-11-01), Shim et al.
patent: 2007/0108581 (2007-05-01), Shim et al.
patent: 2007/0181990 (2007-08-01), Huang et al.
patent: 2007/0190690 (2007-08-01), Chow et al.
patent: 2007/0216010 (2007-09-01), Yim et al.
patent: 2007/0246815 (2007-10-01), Lu et al.
patent: 2007/0278696 (2007-12-01), Lu et al.
patent: 2008/0157325 (2008-07-01), Chow et al.
patent: 2009/0085178 (2009-04-01), Ha et al.
patent: 2009/0152692 (2009-06-01), Chow et al.
patent: 2009/0152700 (2009-06-01), Kuan et al.
patent: 2009/0155960 (2009-06-01), Chow et al.

Affiliated with

Also associated with

Rating

Integrated circuit package system with interconnect lock does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package system with interconnect lock, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package system with interconnect lock will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2627168