4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Lim Peng Soon

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Apparatus and method for miniature semiconductor packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Apparatus and method for miniature semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Stress relieving film for semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Ultra-low loop wire bonding

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lim Peng Soon does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Lim Peng Soon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lim Peng Soon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2859094

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure