4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Leonel R. Arana

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Adhesive system for supporting thin silicon wafer

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Directing the flow of underfill materials using magnetic...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electrically-isolated interconnects and seal rings in...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Method of forming through-silicon vias with stress buffer...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of forming through-silicon vias with stress buffer...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2342564

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