Method of forming through-silicon vias with stress buffer...

Details Method of forming through-silicon vias with stress buffer... Method of forming through-silicon vias with stress buffer...

2008-07-22

2008-07-22

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S624000, C438S629000, C438S667000, C438S672000, C257S774000, C257SE21577

Reexamination Certificate

active

11169595

ABSTRACT:
A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed.

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PCT/US2006/025471, PCT Search Report Dated: Nov. 23, 2006, 13 pages.

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