4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Laval Chung-Long-Shan

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Assembly of electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Electronic component with wire bonds in low modulus fill...

Electricity: conductors and insulators – Boxes and housings – With electrical device
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Electronic device with wire bonds adhered between integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Integrated circuit support for low profile wire bond

Incremental printing of symbolic information – Ink jet – Ejector mechanism
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Method of adhering wire bond loops to reduce loop height

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2168026

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