Integrated circuit support for low profile wire bond

Details Integrated circuit support for low profile wire bond Integrated circuit support for low profile wire bond

2007-09-25

2010-11-02

Rojas, Omar (Department: 2874)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

07824013

ABSTRACT:
A microprocessor device that has a support structure with a chip mounting area and a conductor mounting area. An inkjet printhead IC is supported on the chip mounting area. The inkjet printhead IC has a back surface in contact with the chip mounting area and an active surface opposing the back surface. The active surface has electrical contact pads and an array of ink ejection nozzles. The active surface has electrical contact pads for its circuitry and functional elements. A plurality of electrical conductors are, at least partially, supported on the conductor mounting area and a series of wire bonds extending from the electrical contact pads to the plurality of electrical conductors supported on the conductor mounting area wherein, the chip mounting area is raised relative to the conductor mounting area. By raising the chip mounting area relative to the rest of the PCB, or at least the conductors connected to the PCB end of the wire bonds, the top of the arc formed by the layer is much closer to the active surface of the die. This, in turn, allows the bead of encapsulant to have a lower profile relative to the active surface. With a lower encapsulant bead, the active surface can be brought into closer proximity with another surface without making contact. For example, the nozzle array on a printhead IC can be 300 microns to 400 microns from the paper path.

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patent: WO 03/006230 (2003-01-01), None

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