Method of adhering wire bond loops to reduce loop height

Details Method of adhering wire bond loops to reduce loop height Method of adhering wire bond loops to reduce loop height

2011-01-25

2011-01-25

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S127000

Reexamination Certificate

active

07875504

ABSTRACT:
A method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die with a contact pad to a printed circuit board with a conductor, by mounting the integrated circuit die such that the contact pad is spaced from the conductor, positioning an adhesive surface between the contact pad and the conductor on the printed circuit board, attaching wire to one of the contact pad or the conductor, drawing the wire towards the other of the contact pad or the conductor, allowing the wire to contact the adhesive surface, and, attaching the wire to the other of the contact pad of the conductor to form a wire bond adhered to the adhesive surface and a point intermediate its ends.

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