Assembly of electronic components

Details Assembly of electronic components Assembly of electronic components

2010-06-10

2011-10-18

Sandvik, Benjamin (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257SE23065, C257SE23024

Reexamination Certificate

active

08039974

ABSTRACT:
An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.

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