Electronic device with wire bonds adhered between integrated...

Details Electronic device with wire bonds adhered between integrated... Electronic device with wire bonds adhered between integrated...

2008-03-12

2010-06-22

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S784000, C257SE23168, C257SE23151

Reexamination Certificate

active

07741720

ABSTRACT:
An electronic device that has an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors corresponding to each of the contact pads respectively, wire bonds electrically connecting each of the contact pads to the corresponding conductors and, an adhesive surface positioned between the contacts pads and the corresponding conductors. The wire bonds are secured to the adhesive surface to hold them in a low profile configuration.

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