Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Composite flip-chip package with encased components and...
High performance flipchip package that incorporates heat...
Leaded substrate carrier for integrated circuit device and leade
Low cost thermally enhanced flip chip BGA
Method of adding filler into a non-filled underfill system...
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Profile ID: LFUS-PAI-P-698034