Composite flip-chip package with encased components and...

Details Composite flip-chip package with encased components and... Composite flip-chip package with encased components and...

2006-08-29

2008-05-27

Pham, Hoai v (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S778000, C257SE23178

Reexamination Certificate

active

07378733

ABSTRACT:
Composite flip-chip with encased components and method of fabricating the same is described. One aspect of the invention relates to fabricating composite flip-chip packages for integrated circuit dice. Interposing substrates are formed. At least one discrete component is attached to a bottom surface of each of the interposing substrates. A first array of solder balls is placed on the bottom surface of each of the interposing substrates. The interposing substrates are mounted to a carrier strip. The integrated circuit dice are attached to top surfaces of the interposing substrates. The integrated circuit dice and the interposing substrates are encapsulated in molding compound to define flip-chip assemblies.

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Xilinx, Inc.; U.S. Appl. No. 11/511,969 by Hoang et al. on Aug. 29, 2006.
U.S. Appl. No. 11/511,833, filed Aug. 29, 2006, Wu et al.
U.S. Appl. No. 12/028,434, filed Feb. 8, 2008, Wu et al.

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