Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-06-13
2006-06-13
Pert, Evan (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S724000, C257S730000
Reexamination Certificate
active
07061102
ABSTRACT:
A semiconductor flipchip package includes a central cavity area on the first major side for receiving a flipchip die therein. The package substrate is substantially made from a single material that serves as the support and stiffener and provides within the cavity floor all the connecting points for flipchip interconnection to the silicon die. The integral cavity wall serves as a stiffener member of the package and provides the required mechanical stability of the whole arrangement without the need for a separate stiffener material to be adhesively attached. The cavity walls may contain extra routing metallization to create bypass capacitors to enhance electrical performance. Optional methods to cover the silicon die enhance thermal performance of the package.
REFERENCES:
patent: 4598307 (1986-07-01), Wakabayashi et al.
patent: 5387888 (1995-02-01), Eda et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5410805 (1995-05-01), Pasch et al.
patent: 5463529 (1995-10-01), Chia et al.
patent: 5568683 (1996-10-01), Chia et al.
patent: 5608261 (1997-03-01), Bhattacharyya et al.
patent: 5637920 (1997-06-01), Loo
patent: 5700723 (1997-12-01), Barber
patent: 5723369 (1998-03-01), Barber
patent: 5726079 (1998-03-01), Johnson
patent: 5739585 (1998-04-01), Akram et al.
patent: 5831825 (1998-11-01), Fromont
patent: 5889323 (1999-03-01), Tachibana
patent: 5892280 (1999-04-01), Crane et al.
patent: 5900675 (1999-05-01), Appelt et al.
patent: 5939782 (1999-08-01), Malladi
patent: 5977633 (1999-11-01), Suzuki et al.
patent: 6020221 (2000-02-01), Lim et al.
patent: 6020637 (2000-02-01), Karnezos
patent: 6028358 (2000-02-01), Suzuki
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6133634 (2000-10-01), Joshi
patent: 6154370 (2000-11-01), Degani et al.
patent: 6201301 (2001-03-01), Hoang
patent: 6272020 (2001-08-01), Tosaki et al.
patent: 6368514 (2002-04-01), Metzler
patent: 6436332 (2002-08-01), Fasano et al.
patent: 0 359 513 (1989-09-01), None
patent: 1 061 577 (2000-12-01), None
patent: 08335650 (1995-06-01), None
patent: 11026635 (1997-07-01), None
patent: 2001044243 (1999-07-01), None
Eghan Abu K.
Hoang Lan H.
Brown Scott
Pert Evan
Xilinx , Inc.
Young Edel M.
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