4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Field effect device
  6. Having insulated electrode

Lakshminarayan Viswanathan

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Method of manufacturing a wire bond-less electronic...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Method of packaging a semiconductor die and package thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor component and method for manufacturing the...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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Profile ID: LFUS-PAI-P-1902817

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