Method of manufacturing a wire bond-less electronic...

Details Method of manufacturing a wire bond-less electronic... Method of manufacturing a wire bond-less electronic...

2005-01-18

2005-01-18

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257S718000, C257S719000, C257S727000, C257S728000

Reexamination Certificate

active

06844221

ABSTRACT:
A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate (110, 410), an electronic device (130) over the support substrate, and a cover (140, 440, 540) located over the electronic device and the support substrate. The cover includes an interconnect structure (141, 441, 541) electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit for providing impedance transformation of an electrical signal between the electronic device and the circuit.

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patent: 1079433 (2001-02-01), None
patent: 4100102928 (1996-06-01), None
patent: 11031757 (1999-02-01), None
patent: 2001053197 (2001-02-01), None

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