Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1999-04-07
2000-06-06
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257718, 257728, H01L 2334
Patent
active
06072238&
ABSTRACT:
A semiconductor device (10) suitable for use in RF applications and a method of forming the semiconductor device (10). An RF transistor die (31) is bonded to a heatsink (21). The heatsink (21) having the semiconductor chip (31) mounted thereto is coupled to a printed circuit board (11), wherein the RF transistor die (31) extends through an opening (14) in the printed circuit board (11). Conductors (18, 19) on the printed circuit board (11) are coupled to the semiconductor chip (31) via wirebonds (35, 36).
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Abdo David F.
Miller Gerald R.
Viswanathan Lakshminarayan
Clark Sheila V.
Motorola Inc.
Parker Lanny L.
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