Method of packaging a semiconductor die and package thereof

Details Method of packaging a semiconductor die and package thereof Method of packaging a semiconductor die and package thereof

2006-01-20

2008-11-04

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

Reexamination Certificate

active

07445967

ABSTRACT:
A method of packaging a semiconductor die includes the steps of providing a flange (110), coupling one or more active die (341) to the flange with a lead-free die attach material (350), staking a leadframe (120) to the flange after coupling the one or more active die to the flange, electrically interconnecting the one or more active die and the leadframe with an interconnect structure (470), and applying a plastic material (130) over the flange, the one or more active die, the leadframe, and the interconnect structure.

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International Search Report and Written Opinion.

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