Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Direct bonding of copper to aluminum nitride substrates
Direct thermocompression bonding for thin electronic power chips
Direct thermocompression bonding for thin electronic power chips
Method for forming semiconductor electrical contacts using metal
Process for self-alignment and planarization of semiconductor ch
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Profile ID: LFUS-PAI-P-28182