4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Kunihiko Nishi

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Apparatus for pre-heating resin tablet

Electric heating – Metal heating – Of cylinders
Patent

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Bonding method of semiconductor and laminated structure...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Manufacturing method of a semiconductor device

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate

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Method and apparatus for cooperated design

Boots – shoes – and leggings
Patent

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Method and apparatus for encapsulating semi-conductors

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent

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Profile ID: LFUS-PAI-P-28215

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