Method and apparatus for encapsulating semi-conductors

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article

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249 85, 425116, B29C 4514, B29C 4526

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active

049005014

ABSTRACT:
A resin-molded semiconductor is produced by using an apparatus which comprises a mold having a plurailty of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, said cavities being filled with a molding resin fed under pressure from said pots, with a part to be molded placed in each cavity. The process and apparatus of this invention prevent the molding defects resulting from the excessive flow resistance of resin and greatly improves the use efficiency of resin.

REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3484533 (1969-12-01), Kaufman
patent: 3611061 (1971-10-01), Segerson
patent: 3651448 (1972-03-01), Pauza
patent: 3672046 (1972-06-01), Storey et al.
patent: 3698074 (1972-10-01), Helda et al.
patent: 3716764 (1973-02-01), Birchler et al.
patent: 4368168 (1983-01-01), Slepcevic
patent: 4404744 (1983-09-01), Stenz et al.
patent: 4513942 (1985-04-01), Creasman
patent: 4599062 (1986-07-01), Konishi
patent: 4632653 (1986-12-01), Plocher
Anon., Electronics Review, "Manufacturing", Jul. 24, 1967, pp. 36-38.

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