Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1986-10-30
1990-02-13
Hoag, Willard E.
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
249 85, 425116, B29C 4514, B29C 4526
Patent
active
049005014
ABSTRACT:
A resin-molded semiconductor is produced by using an apparatus which comprises a mold having a plurailty of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, said cavities being filled with a molding resin fed under pressure from said pots, with a part to be molded placed in each cavity. The process and apparatus of this invention prevent the molding defects resulting from the excessive flow resistance of resin and greatly improves the use efficiency of resin.
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Anon., Electronics Review, "Manufacturing", Jul. 24, 1967, pp. 36-38.
Kaneda Aizo
Nakagawa Takashi
Nishi Kunihiko
Ozawa Masakazu
Saeki Junichi
Hitachi , Ltd.
Hoag Willard E.
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