4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Kun-Ching Chen

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active

Ball grid array semiconductor package with improved strength...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Chip scale package and manufacturing method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Flip chip package substrate

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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High frequency substrate comprised of dielectric layers of...

Wave transmission lines and networks – Long lines – Strip type
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Profile ID: LFUS-PAI-P-1482143

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