Wave transmission lines and networks – Long lines – Strip type
Reexamination Certificate
2006-06-13
2006-06-13
Lee, Benny (Department: 2817)
Wave transmission lines and networks
Long lines
Strip type
C333S246000
Reexamination Certificate
active
07061347
ABSTRACT:
A high frequency substrate includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a high-frequency signal transmission line. The first dielectric layer is formed on the first metal layer, and the second metal layer is formed on the first dielectric layer. The first and second metal layers are maintained in a stable voltage status due to the high dielectric coefficient of the first dielectric layer. Besides, the second dielectric layer is formed on the second metal layer. High speed and high frequency transmission are achieved when signals transmitting in the high-frequency transmission line formed on the second dielectric layer due to the low dielectric coefficient of the second dielectric layer.
REFERENCES:
patent: 3906387 (1975-09-01), Martel et al.
patent: 5212463 (1993-05-01), Babbitt et al.
patent: 5652557 (1997-07-01), Ishikawa
patent: 5753968 (1998-05-01), Bahl et al.
patent: 6263220 (2001-07-01), Mansour
patent: 6360112 (2002-03-01), Mizuno et al.
Chen Kun-Ching
Wu Sung-Mao
Advanced Semiconductor Engineering Inc.
Lee Benny
Thomas Kayden Horstemeyer & Risley
LandOfFree
High frequency substrate comprised of dielectric layers of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High frequency substrate comprised of dielectric layers of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High frequency substrate comprised of dielectric layers of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3628090