High frequency substrate comprised of dielectric layers of...

Wave transmission lines and networks – Long lines – Strip type

Reexamination Certificate

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C333S246000

Reexamination Certificate

active

07061347

ABSTRACT:
A high frequency substrate includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a high-frequency signal transmission line. The first dielectric layer is formed on the first metal layer, and the second metal layer is formed on the first dielectric layer. The first and second metal layers are maintained in a stable voltage status due to the high dielectric coefficient of the first dielectric layer. Besides, the second dielectric layer is formed on the second metal layer. High speed and high frequency transmission are achieved when signals transmitting in the high-frequency transmission line formed on the second dielectric layer due to the low dielectric coefficient of the second dielectric layer.

REFERENCES:
patent: 3906387 (1975-09-01), Martel et al.
patent: 5212463 (1993-05-01), Babbitt et al.
patent: 5652557 (1997-07-01), Ishikawa
patent: 5753968 (1998-05-01), Bahl et al.
patent: 6263220 (2001-07-01), Mansour
patent: 6360112 (2002-03-01), Mizuno et al.

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