4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Koushik Banerjee

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An electronic package that has a die coupled to a lead frame by

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Bond pad functional layout on die to improve package manufactura

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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Bond pad functional layout on die to improve package...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Design for mounting discrete components inside an integrated cir

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Heat slug design which facilitates mounting of discrete...

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-131312

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