Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-02-25
1995-08-22
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 524, 257675, 361723, H05K 720
Patent
active
054446023
ABSTRACT:
An electronic package which has a heat sink that is attached to the lead frame of the package with a material that is both electrically and thermally conductive. The lead frame is also coupled to a first surface of an integrated circuit die with tape automated bonded (TAB) leads. The low thermal resistance of the heat sink increases the thermal performance of the package. The heat sink may also be mounted directly to the die with a conductive material so that the die is electrically grounded to the heat sink. The heat sink is then bonded to the leads of the lead frame that are dedicated to ground. In this embodiment, the heat sink provides the dual functions of a ground plate and a heat spreader.
REFERENCES:
patent: 4802532 (1989-02-01), Dawes
patent: 4807018 (1989-02-01), Cellai
patent: 5065281 (1991-11-01), Hernandez
patent: 5105259 (1992-04-01), McShane
patent: 5172213 (1992-12-01), Zimmerman
patent: 5262925 (1993-11-01), Matta
patent: 5334872 (1994-08-01), Ueda
patent: 5365409 (1994-11-01), Kwon
Banerjee Koushik
Jain Praveen
Mallik Debendra
Natarajan Siva
Intel Corporation
Tolin Gerald P.
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