Design for mounting discrete components inside an integrated cir

Details Design for mounting discrete components inside an integrated cir Design for mounting discrete components inside an integrated cir

1997-10-21

1998-09-22

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257693, 257697, 257924, H01L 2334, H01L 2348, H01L 2302

Patent

active

058118802

ABSTRACT:
An electronic package which contains discrete resistive and capacitive components used to control the operating device of an integrated circuit located within the package. The package has a bonding shelf that has a plurality of bond fingers which are connected to the integrated circuit. The discrete passive components are mounted to the bonding shelf and connected to the bond fingers by lead traces. The lead traces terminate at the discrete devices so that the resistor and capacitor cannot be accessed through the external contacts of the package. The integrated circuit and discrete components are typically enclosed by a molded plastic material to prevent physical access to the devices without damaging the package.

REFERENCES:
patent: 5103283 (1992-04-01), Hite
patent: 5237204 (1993-08-01), Vac

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