4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Konstantinos I. Papathomas

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Cap attach surface modification for improved adhesion

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Cap attach surface modification for improved adhesion

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Cap attach surface modification for improved adhesion

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Composite for providing a rigid-flexible circuit board construct

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Composite for providing a rigid-flexible circuit board construct

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Profile ID: LFUS-PAI-P-295712

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