Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-06-20
2006-06-20
Richards, N. Drew (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S121000, C438S508000
Reexamination Certificate
active
07064013
ABSTRACT:
An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.
REFERENCES:
patent: 3551304 (1970-12-01), Letter et al.
patent: 4888449 (1989-12-01), Crane et al.
patent: 4952904 (1990-08-01), Johnson et al.
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 4985751 (1991-01-01), Shiobara et al.
patent: 5413950 (1995-05-01), Chen et al.
patent: 5466617 (1995-11-01), Shannon
patent: 5471366 (1995-11-01), Ozawa
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5586385 (1996-12-01), Nishino et al.
patent: 5604380 (1997-02-01), Nishimura et al.
patent: 5619070 (1997-04-01), Kozono
patent: 5681402 (1997-10-01), Ichinose et al.
patent: 5706579 (1998-01-01), Ross
patent: 5726079 (1998-03-01), Johnson
patent: 5757061 (1998-05-01), Satoh et al.
patent: 5760480 (1998-06-01), You et al.
patent: 5811317 (1998-09-01), Maheshwari et al.
patent: 5821628 (1998-10-01), Hotta
patent: 5847929 (1998-12-01), Bernier
patent: 5891753 (1999-04-01), Akram
patent: 5909056 (1999-06-01), Mertol
patent: 6232563 (2001-05-01), Kim et al.
patent: 2297503 (1996-08-01), None
patent: 01191456 (1989-08-01), None
Buchwalter Stephen Leslie
Dang Hung Manh
Gaynes Michael A.
Papathomas Konstantinos I.
Richards N. Drew
Schmeiser Olsen & Watts
Steinberg William H.
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