Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1994-02-07
1995-01-03
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156656, 156902, B44C 122, C23F 100
Patent
active
053783069
ABSTRACT:
A rigid-flexible circuit board is fabricated by providing a core having a dielectric substrate and conductive layer thereon. A sub-composite comprising a polyimide and rigid dielectric substrate adjacent the conductive layer and in both the rigid and flexible segments of the board is provided. A release layer corresponding to the flexible segment of the board is provided. A rigid bonding layer is provided at rigid segments of the board but not at the flexible segments. A composite is formed by providing a second conductive layer adjacent the rigid bonding layer. The composite is laminated. Portions of the second conductive layer corresponding to the flexible segment and release layer are removed.
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IBM Disclosure Bulletin vol. 28, No. 12, May 1986.
Cibulsky Michael J.
Papathomas Konstantinos I.
Summa William J.
Wang David W.
Zippetelli Patrick R.
International Business Machines - Corporation
Powell William
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