4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Kong Bee Tiu

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Method of forming a substrateless semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Stacked die semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Stacked die semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Wirebonding insulated wire

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Wirebonding insulated wire and capillary therefor

Metal fusion bonding – Process – Using high frequency vibratory energy
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Profile ID: LFUS-PAI-P-2827665

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