Wirebonding insulated wire and capillary therefor

Details Wirebonding insulated wire and capillary therefor Wirebonding insulated wire and capillary therefor

2007-08-28

2007-08-28

Bos, Steven (Department: 1754)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S111000, C228S164000, C228S170000, C228S180500, C156S073200

Reexamination Certificate

active

10652434

ABSTRACT:
An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire (14) over the surface of the second bond pad (18) such that the bond wire (14) is rubbed between the capillary tip (20) and the second bond pad (18), which tears the bond wire insulation so that at least a portion of a metal core of the wire (14) contacts the second bond pad (18). The wire (14) is then bonded to the second pad (18) using thermocompression bonding. The tip of the capillary (20) is roughened to enhance the tearing of the bond wire insulation.

REFERENCES:
patent: 3750926 (1973-08-01), Sakamoto et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5601740 (1997-02-01), Eldridge et al.
patent: 5842628 (1998-12-01), Nomoto et al.
patent: 6073827 (2000-06-01), Razon et al.
patent: 6321969 (2001-11-01), Miller
patent: 6354479 (2002-03-01), Reiber et al.
patent: 6497356 (2002-12-01), Miller et al.
patent: 6523733 (2003-02-01), Miller et al.
patent: 6854637 (2005-02-01), Harun et al.
patent: 54159683 (1979-12-01), None
patent: 01261838 (1989-10-01), None
patent: 01264234 (1989-10-01), None
Translation of JP 01261838 A.

Affiliated with

Also associated with

Rating

Wirebonding insulated wire and capillary therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wirebonding insulated wire and capillary therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wirebonding insulated wire and capillary therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3895242