Stacked die semiconductor device

Details Stacked die semiconductor device Stacked die semiconductor device

2007-05-01

2007-05-01

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000

Reexamination Certificate

active

11047173

ABSTRACT:
A stacked multichip package (100) has a base carrier (102) having a top side (108) and a bottom side (110), a bottom integrated circuit die (104) having a bottom surface (112) attached to the base carrier top side (108), and an opposing, top surface (114). The top surface (114) has a peripheral area including a plurality of first bonding pads and a central area (120). A bead (124) is formed on the top surface (114) of the bottom die (104) between the peripheral area and the central area (120). A top integrated circuit die (106) having a bottom surface is positioned over the bottom die (104) and the bottom surface of the top die (106) is attached to the top surface (114) of the bottom die (104) via the bead (124). The bead (124) maintains a predetermined spacing between the bottom die (104) and the top die (106) so that wirebonds of first wires (122) connecting the bottom die (104) to the base carrier (102) are not damaged when the top die (106) is attached to the bottom die (104).

REFERENCES:
patent: 5323060 (1994-06-01), Fogel
patent: 6034429 (2000-03-01), Glenn
patent: 6333562 (2001-12-01), Lin
patent: 6530515 (2003-03-01), Glenn et al.
patent: 6593662 (2003-07-01), Pu et al.
patent: 2002/0195624 (2002-12-01), Glenn et al.
patent: 2003/0038357 (2003-02-01), Derderian
patent: 445610 (2001-07-01), None
“3D Technology Stacked CSP”; Amkor Technology Presentation Materials; Dec. 2000; 37 pgs.

Affiliated with

Also associated with

Rating

Stacked die semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked die semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked die semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3727973