Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2005-02-15
2005-02-15
Edmondson, L. (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S004500, C257S734000, C257S784000
Reexamination Certificate
active
06854637
ABSTRACT:
An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.
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Harun Fuaida
Tiu Kong Bee
Edmondson L.
Freescale Semiconductor Inc.
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