Method of forming a substrateless semiconductor package

Details Method of forming a substrateless semiconductor package Method of forming a substrateless semiconductor package

2007-01-09

2007-01-09

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S737000

Reexamination Certificate

active

11108220

ABSTRACT:
A method of forming a substrateless semiconductor package (10) includes forming a carrier (16) on a base plate (12) and attaching an integrated circuit (IC) die (32) to the carrier (16). The IC die (32) then is electrically connected to the carrier (16). A molding operation is performed to encapsulate the IC die (32), the electrical connections (36) and the carrier (16). Thereafter, the base plate (12) is removed.

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patent: 6383838 (2002-05-01), Ryu
patent: 2002/0017721 (2002-02-01), Huang
patent: 2005/0009317 (2005-01-01), Lin
patent: 2005/0062152 (2005-03-01), Tsai
International Search Report.

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