4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Responsive to non-electrical signal
  6. Electromagnetic or particle radiation

Kimberly Trice

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Bond pad for wafer and package for CMOS imager

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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Circuit structure with low dielectric constant regions and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Conducting layer in chip package module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Connection structure and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Control element of an organic electro-luminescent display...

Semiconductor device manufacturing: process – Having organic semiconductive component
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Profile ID: LFUS-PAI-P-2175362

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