Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Reexamination Certificate
2004-10-22
2008-08-05
Kerns, Kevin P (Department: 1793)
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
Reexamination Certificate
active
07407080
ABSTRACT:
A capillary tip for a wire bonding tool has a chamfer provided with at least one annular groove. The annular groove is generally oriented in a plane perpendicular to the axis of the capillary. In a sectional view through the capillary axis, the groove profile may be generally part-oval or part circular, such as semicircular or half-oval; or generally rectangular; or generally triangular. In some embodiments the width of the groove profile at the face of the chamfer is at least about one-tenth, more usually at least about one-fifth, the length of the chamfer face; and less than about one-half, more usually less than about one-third, the length of the chamfer face. In some embodiments two or more such grooves are provided. The grooved chamfer can improve the transmission of ultrasonic energy to the wire ball during formation of the bond.
REFERENCES:
patent: 4437604 (1984-03-01), Razon et al.
patent: 4860941 (1989-08-01), Otto
patent: 5226582 (1993-07-01), Kubota et al.
patent: 5465899 (1995-11-01), Quick et al.
patent: 5544804 (1996-08-01), Test et al.
patent: 5558270 (1996-09-01), Nachon et al.
patent: 5559054 (1996-09-01), Adamjee
patent: 5842628 (1998-12-01), Nomoto et al.
patent: 5871141 (1999-02-01), Hadar et al.
patent: 5874780 (1999-02-01), Murakami
patent: 5938105 (1999-08-01), Singh
patent: 5954260 (1999-09-01), Orcutt
patent: 5960262 (1999-09-01), Torres et al.
patent: 5984162 (1999-11-01), Hortaleza et al.
patent: 6065667 (2000-05-01), Singh
patent: 6155474 (2000-12-01), Orcutt
patent: 6207549 (2001-03-01), Higashi et al.
patent: 6213378 (2001-04-01), Singh
patent: 6232211 (2001-05-01), Tsukahara
patent: 6295729 (2001-10-01), Beaman et al.
patent: 6325269 (2001-12-01), Suzuki et al.
patent: 6457627 (2002-10-01), Komiyama
patent: 6499648 (2002-12-01), Shieh et al.
patent: 6595406 (2003-07-01), Chapman et al.
patent: 6910612 (2005-06-01), Perlberg et al.
patent: 2005/0121493 (2005-06-01), Mironescu et al.
patent: 2002-368034 (2002-12-01), None
Jang Ki-Youn
Kim Chulsik
Kim Jong Kook
Lee Hun-Teak
Lee Kenny
Chippac Inc.
Kerns Kevin P
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