4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With means to control surface effects
  6. Insulating coating

Kevin Jeng

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active

Ball-limiting metallurgies, solder bump compositions used...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Ball-limiting metallurgies, solder bump compositions used...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bonding pad structure having an interposed rigid layer

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Patent

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Forming a cap above a metal layer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Wire bonding surface and bonding method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1974396

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