Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-01-01
2008-01-01
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S612000, C029S840000, C029S860000, C228S180220
Reexamination Certificate
active
07314819
ABSTRACT:
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that withstands higher temperature reflows and other higher temperature processes.
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Hua Fay
Jeng Kevin
Seshan Krishna
Wu Albert T.
Baumeister B. William
Intel Corporation
Schwegman Lundberg & Woessner, P.A.
Wagner Jenny L
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