Bonding pad structure having an interposed rigid layer

Details Bonding pad structure having an interposed rigid layer Bonding pad structure having an interposed rigid layer

1993-03-31

1996-10-22

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

257673, 257741, 257753, 257780, 257781, H01L 2358, H01L 23495, H01L 2348

Patent

active

055679811

ABSTRACT:
A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.

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