4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With semiconductor element forming part

Kensho Murata

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Lead-free solder

Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
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Lead-free solder alloy

Metal treatment – Stock
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Semiconductor chip mounting substrate and semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Semiconductor device and its manufacturing method

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
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Semiconductor device and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Profile ID: LFUS-PAI-P-775138

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