Lead-free solder

Details Lead-free solder Lead-free solder

2007-10-16

2007-10-16

Ip, Sikyin (Department: 1742)

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

C420S557000, C148S400000

Reexamination Certificate

active

10824647

ABSTRACT:
A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.

REFERENCES:
patent: 6179935 (2001-01-01), Yamashita et al.
patent: 6843862 (2005-01-01), Chew et al.
patent: 2002/0051728 (2002-05-01), Sato et al.
patent: 2003/0024733 (2003-02-01), Aoyama et al.
patent: 0336575 (1989-10-01), None
Patent Abstracts of Japan, vol. 2000, No. 20, Jul. 10, 2001, abstract of JP 2001-071173 A published on Mar. 21, 2001.
Patent Abstracts of Japan, vol. 2000, No. 04, Aug. 31, 2000, abstract of JP 2000-015476 A published on Jan. 18, 2000.
Patent Abstracts of Japan, vol. 1998, No. 08, Jun. 30, 1998, abstract of JP 10-076389 A published on Mar. 24, 1998.
Patent Abstracts of Japan, vol. 2002, No. 12, Dec. 12, 2002, abstract of JP 2002-239780 A published on Aug. 28, 2002.

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