Lead-free solder alloy

Details Lead-free solder alloy Lead-free solder alloy

2006-04-18

2006-04-18

Ip, Sikyin (Department: 1742)

Metal treatment

Stock

C420S560000, C420S561000, C420S562000

Reexamination Certificate

active

07029542

ABSTRACT:
A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.

REFERENCES:
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patent: 6319461 (2001-11-01), Domi et al.
patent: 2003/0021718 (2003-01-01), Munekata et al.
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patent: 1213089 (2002-06-01), None
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patent: 9709455 (1997-03-01), None
Patent Abstracts of Japan, vol. 2000, No. 01, Jan. 31, 2000. Abstract for JP 11 277290 A (Murata Mfg. Co. Ltd.), which was published on Oct. 12, 1999.

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