Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-11-15
2005-11-15
Vigushin, John B. (Department: 2841)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S782000, C257S784000, C174S260000
Reexamination Certificate
active
06965162
ABSTRACT:
A semiconductor device designed to reduce the warp of a substrate due to curing contraction, etc. of an insulation pattern while forming the insulation pattern on the surface of a substrate so that it may be interposed between a semiconductor chip and a conductor pattern by offering a semiconductor chip mounting substrate equipped with a flexible substrate11(insulating film16) having a chip mounting region19for mounting a semiconductor chip13via an adhesive12, conductor patterns20that are formed on the surface of the above-mentioned substrate11and electrically connected to the semiconductor chip13in an external region of the above-mentioned chip mounting region19, and an insulation pattern21formed on the surface of the substrate11and partially in the chip mounting region19so that it may be interposed between the semiconductor chip13and the conductor patterns20.
REFERENCES:
patent: 5729049 (1998-03-01), Corisis et al.
patent: 6232650 (2001-05-01), Fujisawa et al.
patent: 6562661 (2003-05-01), Grigg
patent: 6853086 (2005-02-01), Nakayama
Murata Kensho
Sakamoto Kunio
Yoshino Makoto
Brady III Wade James
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
Vigushin John B.
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