4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Kenichi Tokuno

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active

Bare chip mounting structure and manufacturing method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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Bare chip test carrier with an improved holding structure for a

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Chip component mounting board, chip component mounting structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Device module comprising a substrate having grooves fixed to cir

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Device module comprising a substrate having grooves fixed to cir

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Profile ID: LFUS-PAI-P-1021042

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