Device module comprising a substrate having grooves fixed to cir

Details Device module comprising a substrate having grooves fixed to cir Device module comprising a substrate having grooves fixed to cir

1997-05-16

1998-06-09

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438108, H01L 2160

Patent

active

057632952

ABSTRACT:
A device module with a circuit chip and a print-circuit substrate on which a pattern of grooves is formed by selective etching. A liquid sealing material is in the space between the circuit chip and the surface of the substrate, fixing the circuit chip on the surface of the substrate. The circuit chip has a plurality of electrodes arranged in a first pattern, and the substrate has a plurality of connection terminals arranged in the first pattern within a chip mounting area on a surface thereof. Each of the grooves passes between two adjacent connection terminals through the chip mounting area, and both ends of each groove protrudes from the periphery of the chip mounting area. After the circuit chip is placed on the chip mounting area with the respective electrodes corresponding to the connection terminals, a liquid sealing material may be spread more easily into the space between the circuit chip and the substrate by the use of capillary action to provide a more reliable and efficient seal.

REFERENCES:
patent: 5347162 (1994-09-01), Pasch
patent: 5458694 (1995-10-01), Nuyen
patent: 5482896 (1996-01-01), Tang
patent: 5579573 (1996-12-01), Baker et al.
patent: 5668059 (1997-09-01), Christe et al.

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