Chip component mounting board, chip component mounting structure

Details Chip component mounting board, chip component mounting structure Chip component mounting board, chip component mounting structure

1997-12-01

2000-07-25

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361807, 361808, 361812, 361764, 361765, 361768, 26427211, 26427217, 174 522, 174 523, 257737, 257787, 257788, 257789, 257791, 257778, H05K 702

Patent

active

060943548

ABSTRACT:
A chip component mounting board includes a chip mounting portion and a first groove. A chip component is mounted on the chip mounting portion. The chip mounting portion has a connection pad electrically connected to the chip component. The first groove is formed in the chip mounting portion to extend from a center of the chip mounting portion to one side of the chip mounting portion while gradually increasing its width. A method of manufacturing a chip component mounting board is also disclosed.

REFERENCES:
patent: 5399805 (1995-03-01), Tyler et al.
patent: 5424251 (1995-06-01), Sono et al.
patent: 5570272 (1996-10-01), Variot
patent: 5780776 (1998-07-01), Noda
patent: 5846477 (1998-12-01), Hotta et al.
patent: 5864178 (1999-01-01), Yamada et al.
"Technique of Mounting Flip Chip on Printed Wiring Board" (Semiconductor World, Special Edition, pp. 139-144, 1993).
"High-density Printed Wiring Board for Portable Device of Next Generation", (Nikkei Electronics, No. 633, pp. 99-116, Apr. 1995).

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