Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1995-09-28
1997-11-11
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257778, 257786, 257787, H01L 2331
Patent
active
056867638
ABSTRACT:
A device module with a circuit chip and a print-circuit substrate on which a pattern of grooves is formed by selective etching. A liquid sealing material is in the space between the circuit chip and the surface of the substrate, fixing the circuit chip on the surface of the substrate. The circuit chip has a plurality of electrodes arranged in a first pattern, and the substrate has a plurality of connection terminals arranged in the first pattern within a chip mounting area on a surface thereof. Each of the grooves passes between two adjacent connection terminals through the chip mounting area, and both ends of each groove protrudes from the periphery of the chip mounting area. After the circuit chip is placed on the chip mounting area with the respective electrodes corresponding to the connection terminals, a liquid sealing material may be spread more easily into the space between the circuit chip and the substrate by the use of capillary action to provide a more reliable and efficient seal.
REFERENCES:
patent: 5347162 (1994-09-01), Pasch
Bonkohara Manabu
Tokuno Kenichi
Hardy David B.
NEC Corporation
Thomas Tom
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