4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Ken M. Lam

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Customized microelectronic device and method for making...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Dual-die integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2052266

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