Customized microelectronic device and method for making...

Details Customized microelectronic device and method for making... Customized microelectronic device and method for making...

2006-06-20

2006-06-20

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C438S613000

Reexamination Certificate

active

07064434

ABSTRACT:
A method and apparatus electrically coupling input/output bond pads that are disposed proximate to one another on a microelectronic device. The apparatus includes a microelectronic device having at least two conductive input/output bond pads electrically coupled to an integrated circuit of the microelectronic device and first and second conductive stud balls bonded to first and second input/output pads, respectively, and a third conductive stud ball bonded to the first and second conductive stud balls. A wire bonding tool in “stud ball” mode is utilized to bond the conductive stud balls.

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