4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Solder wettable contact, lead, or bond

Kejun Zeng

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Controlling interdiffusion rates in metal interconnection...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Method and structure to reduce risk of gold embrittlement in...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method and structure to reduce risk of gold embrittlement in...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Method of semiconductor device assembly including...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Solder joints for copper metallization having reduced...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2842266

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