Method and structure to reduce risk of gold embrittlement in...

Details Method and structure to reduce risk of gold embrittlement in... Method and structure to reduce risk of gold embrittlement in...

2007-11-06

2007-11-06

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S508000, C257S772000

Reexamination Certificate

active

11302859

ABSTRACT:
A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further comprise using the copper-bearing solder as a solder interconnect on a gold-nickel pad.

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patent: 5011658 (1991-04-01), Niedrich
patent: 6744142 (2004-06-01), Liu et al.
patent: 6879041 (2005-04-01), Yamamoto et al.
patent: 2004/0035909 (2004-02-01), Yeh et al.
patent: 2004/0262370 (2004-12-01), Ano

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