Method and structure to reduce risk of gold embrittlement in...

Details Method and structure to reduce risk of gold embrittlement in... Method and structure to reduce risk of gold embrittlement in...

2006-02-28

2006-02-28

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S779000, C257S737000, C257S750000, C257S781000, C420S560000, C420S573000

Reexamination Certificate

active

07005745

ABSTRACT:
A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further comprise using the copper-bearing solder as a solder interconnect on a gold-nickel pad.

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Anand, S. Ashok, “Study on Lead-Free Solder Alloys for Ball Attach Process,” Online http://www.amd.com/us-en/assets/content—type./DownloadableAssets/Pb-free—alloy—ball—attach—process, 30 pages.
Zeng, K. and Tu, K. N., “Reliability Issues of Pb-free Solder Joints in Electronic Packaging Technology,” Department of Materials Science Engineering, UCLA, Los Angeles, California, 2001, 62 pages.
Lewis, Daniel; Notis, Michael; and Grusd, Angela, “Phase Equlibria and Thermal Analysis Near the Au-Pb-Sn Ternary Eutectic,” Online http://www.lehigh.edu/˜djl0/PhEq.html, 5 pages.

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